Energie- und Elektrotechnik

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  • Mechanical structures for electronic equipment; mechanical structures of the 482,6 mm (19")series; components on front panels; mounting conditions, dimensions

    Standard [CURRENT] 1986-12

    DIN 41494-8:1986-12

    Mechanical structures for electronic equipment; mechanical structures of the 482,6 mm (19")series; components on front panels; mounting conditions, dimensions

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  • Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components

    Standard [CURRENT] 1989-09

    DIN 41593:1989-09

    Dimensions for the mounting of single-hole, bush-mounted, spindle-operated electronic components

    from 65.70 EUR VAT included

    from 61.40 EUR VAT excluded

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  • Multipole connectors with blade contacts 2,5 mm × 1 mm; housings and locking devices for connectors DIN 41618 and DIN 41622

    Standard [CURRENT] 1976-02

    DIN 41618-4:1976-02

    Multipole connectors with blade contacts 2,5 mm × 1 mm; housings and locking devices for connectors DIN 41618 and DIN 41622

    from 25.30 EUR VAT included

    from 23.64 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018

    Standard [CURRENT] 2018-10

    DIN EN IEC 60191-1:2018-10

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018

    from 145.40 EUR VAT included

    from 135.89 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

    Standard [CURRENT] 2000-07

    DIN EN 60191-3:2000-07

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

    from 150.80 EUR VAT included

    from 140.93 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

    Technical rule [CURRENT] 2006-08

    DIN EN 60191-3 Beiblatt 1:2006-08

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

    from 58.30 EUR VAT included

    from 54.49 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018

    Standard [CURRENT] 2019-02

    DIN EN 60191-4:2019-02

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018

    from 133.20 EUR VAT included

    from 124.49 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009

    Standard [CURRENT] 2010-06

    DIN EN 60191-6:2010-06

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009

    This part of DIN EN 60191 contains general rules for the preparation of outline drawings of surface mounted semiconductor devices. It supplements DIN EN 60191-1 and DIN EN 60191-3 with ...

    from 145.40 EUR VAT included

    from 135.89 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001

    Standard [CURRENT] 2002-08

    DIN EN 60191-6-1:2002-08

    Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001

    from 58.30 EUR VAT included

    from 54.49 EUR VAT excluded

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  • Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

    Standard [CURRENT] 2002-09

    DIN EN 60191-6-2:2002-09

    Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

    from 80.20 EUR VAT included

    from 74.95 EUR VAT excluded

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