Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011) (german version)

Standard [CURRENT]

OEVE/OENORM EN 62047-9:2012-05-01

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011) (german version)

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 9: Prüfverfahren zur Festigkeit von Full-Wafer-Bondverbindungen in der Mikrosystemtechnik (MEMS) (IEC 62047-9:2011) (deutsche Fassung)
Publication date
2012-05-01
Original language
German
Pages
26

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Publication date
2012-05-01
Original language
German
Pages
26

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