Thermal standardization on semiconductor packages - Part 3: thermal circuit simulation models of discrete semiconductor packages for transient analysis

Standard [NEW]

NF C86-378-3:2025-06-20

NF EN IEC 63378-3:2025-06-20

Thermal standardization on semiconductor packages - Part 3: thermal circuit simulation models of discrete semiconductor packages for transient analysis

German title
Thermische Standardisierung von Halbleitergehäusen - Teil 3: Thermische Schaltungssimulationsmodelle von diskreten Halbleitergehäusen für die Transientenanalyse
Publication date
2025-06-20
Original language
French
Pages
18

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Publication date
2025-06-20
Original language
French
Pages
18

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