Guide to Solder Paste Assessment

Standard [CURRENT]

IPC HDBK-005:2006-02-02

Guide to Solder Paste Assessment

Publication date
2006-02-02
Original language
English
Pages
50

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Publication date
2006-02-02
Original language
English
Pages
50
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Short description

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste.This document has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables currently available. 50 pages. Released January 2006. Included in the IPC-C-103 and the IPC-C-1000 Collections.
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