User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Standard [CURRENT]

IPC 9631:2010-12-15

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

German title
Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.27, Thermischer Stress, Simulation des Konvektions-Reflow-Löten
Publication date
2010-12-15
Original language
English
Pages
11

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Publication date
2010-12-15
Original language
English
Pages
11
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Short description

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.11 pages. Released December 2010. Included in the C-1000 Collections.
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