Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

Standard [NEW]

IPC 2223F:2026-05-01

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

Publication date
2026-05-01
Original language
English
Pages
58

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Publication date
2026-05-01
Original language
English
Pages
58
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Short description

Used in conjunction with the base IPC-2221 printed board design standard, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision F provides new design guidance and requirements for mechanical and physical layout, usage of nonfunctional lands, coverlay access for surface mounting, conductor routing and tradeoffs between panel, pattern and button (pads only) plating for surface and hole copper plating.
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