Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025

Standard [AVAILABLE PRE-PUBLICATION]

DIN EN IEC 61188-6-3:2026-07

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025

German title
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-3: Anschlussflächengestaltung - Beschreibung von Anschlussflächen für Komponenten der Steckmontage (THT) (IEC 61188-6-3:2024); Deutsche Fassung EN IEC 61188-6-3:2025
Publication date
2026-07
Original language
German
Pages
35

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Publication date
2026-07
Original language
German
Pages
35
DOI
https://dx.doi.org/10.31030/3692231
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ICS

31.180, 31.190

DOI

https://dx.doi.org/10.31030/3692231
Replacement amendments

This document partially replaces DIN EN 61188-5-2:2004-05 , DIN EN 61188-5-3:2008-07 , DIN EN 61188-5-4:2008-07 , DIN EN 61188-5-5:2008-07 , DIN EN 61188-5-6:2003-10 , DIN EN 61188-5-8:2008-07 .

And replaced by 2026-07 for:: DIN EN IEC 61188-6-3:2022-04 .

Document timeline
PRE-PUBLISHED
2026-07

Standard [AVAILABLE PRE-PUBLICATION]

DIN EN IEC 61188-6-3:2026-07
Drafts
2022-04 - 2026-07

Draft standard

DIN EN IEC 61188-6-3:2022-04

Cooperation at DIN

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