Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Draft standard

PR NF C93-733-302 - Draft

PR NF EN IEC 61189-3-302

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302 : detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Original language
English, French
Pages
33

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Original language
English, French
Pages
33

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