Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points (IEC 47D/991/CDV) (english version)

Draft standard

OVE EN IEC 63378-6:2025-07-01 - Draft

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points (IEC 47D/991/CDV) (english version)

Publication date
2025-07-01
Original language
English
Pages
34

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Publication date
2025-07-01
Original language
English
Pages
34

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