Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1878/CDV) (english version)

Draft standard

OVE EN IEC 61188-6-3:2023-10-01 - Draft

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1878/CDV) (english version)

Publication date
2023-10-01
Original language
English
Pages
32

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Publication date
2023-10-01
Original language
English
Pages
32

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