Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

Draft standard

DIN EN IEC 61189-2-808:2022-03 - Draft

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode (IEC 91/1690/CD:2020); Text Deutsch und Englisch
Date of issue
2022-02-18
Publication date
2022-03
Original language
German, English
Pages
29

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Date of issue
2022-02-18
Publication date
2022-03
Original language
German, English
Pages
29
DOI
https://dx.doi.org/10.31030/3330624

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ICS

31.180

DOI

https://dx.doi.org/10.31030/3330624
Replacement amendments

Intended replacement to be replaced as of 2025-08 with: DIN EN IEC 61189-2-808:2025-08 .

To be replaced by DIN EN IEC 61189-2-808:2025-08 .

Document timeline
PRE-PUBLISHED
2025-08

Standard [AVAILABLE PRE-PUBLICATION]

DIN EN IEC 61189-2-808:2025-08
Drafts
2022-03 - 2025-08

Draft standard

DIN EN IEC 61189-2-808:2022-03

Cooperation at DIN

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